BGA Reball stencil for Snapdragon / 865 / SM8250 XiaoMi chipset
- SKU: TLS-0247
- Part type: BGA Reball stencil for Snapdragon / 865 / SM8250 XiaoMi chipset
- Condition: Original
- Region:
Redmi 9 / Note 9 4G/ Note 9 Pro
This is a cookie agreement request — you can customize it or disable in the backoffice: Modules / Module manager / AN Cookie Popup.
Product Type
Price
€3.00 - €5.00
Region
We don’t have what you need?
Request a part
SmartGrade Pro™ provides a complete selection of high quality Repair consumables for production based repair.
There are 2 products.
We don’t have what you need?
Request a part