BGA Reball stencil for MSM 8974/ 8274/ 8674 XiaoMi chipset
- SKU: TLS-0237
- Part type: BGA Reball stencil for MSM 8974/ 8274/ 8674 XiaoMi chipset
- Condition: Original
- Region:
Redmi Note / Redmi 2 / 2A
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Soldering tools
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- Product type: BGA Reball stencil for MSM 8974/ 8274/ 8674 XiaoMi chipset