BGA Reball stencil for Snapdragon / 865 / SM8250 XiaoMi chipset
- SKU: TLS-0247
- Part type: BGA Reball stencil for Snapdragon / 865 / SM8250 XiaoMi chipset
- Condition: Original
- Region:
Redmi 9 / Note 9 4G/ Note 9 Pro
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Soldering tools
SmartGrade Pro™ provides a complete selection of high quality Soldering tools for production based repair.
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- Product type: BGA Reball stencil for Snapdragon / 865 / SM8250 XiaoMi chipset