BGA Reball stencil for Snapdragon 665 / 710 / SM6125 / SDM710 XiaoMi chipset
- SKU: TLS-0246
- Part type: BGA Reball stencil for Snapdragon 665 / 710 / SM6125 / SDM710 XiaoMi chipset
- Condition: Original
- Region:
Redmi K30 Pro / MI 10 / 10 Pro
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Soldering tools
SmartGrade Pro™ provides a complete selection of high quality Soldering tools for production based repair.
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- Product type: BGA Reball stencil for Snapdragon 665 / 710 / SM6125 / SDM710 XiaoMi chipset