BGA Reball stencil for Hi6220/ 6250/ MSM8952 Huawei chipset
Product Overview:
SKU: TLS-0224
Device: Soldering tools
Part type: Tool
Condition: Original
Region: Huawei P8 / P9 Youth / 4G
Honor HF 4X / 4C / 5C / 5A
Compatibility: Reball stencils
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Description
Description
The BGA Reball stencil for Hi6220/ 6250/ MSM8952 Huawei chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.
Specifications
Tool
TLS-0224
Soldering tools
Original
Huawei P8 / P9 Youth / 4G
Reball stencils
Original
Lifetime
Lifetime No Hassle Warranty
Lifetime No Hassle Warranty
The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available
SKU: TLS-0449, Device: Power supplies and testing, Part type: Tool, Condition: Original, Region: iPhone X / XS / XS Max, Compatibility: Motherboard test jigs