Small transparent suction-cup for mobile phone repair
SKU: TLS-0022, Device: Opening tools, Part type: Tool, Condition: Original, Region: Universal, Compatibility: Suction cups and clamps, Color: Transparent 
BGA Reball stencil for Hisilicon Kirin 990 HI3690 Huawei chipset
Description
Description
The BGA Reball stencil for Hisilicon Kirin 990 HI3690 Huawei chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.
Specifications
Tool
TLS-0231
Soldering tools
Original
Huawei Mate 30 / 30 Pro / 30RS / Nova 6
Reball stencils
Original
Lifetime
Lifetime No Hassle Warranty
Lifetime No Hassle Warranty
The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available
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