BGA Reball stencil for Hisilicon Kirin 710 HI6260 Huawei chipset

BGA Reball stencil for Hisilicon Kirin 710 HI6260 Huawei chipset

TLS-0229
  • SKU: TLS-0229
  • Tool family: Soldering tools
  • Tool type:: Reball stencils
  • Compatibility: Honor 8X / 20i / 10 / 20 Youth , Enjoy10 / 10P / 9P / 9S, Nova 5I / 4E / 3I / 8
  • Usage:
  • Color: - -
€4.06
Tax included
Receive in 10 days

Description


The BGA Reball stencil for Hisilicon Kirin 710 HI6260 Huawei chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.

ProGrade Tools

ProGrade tools is a professional line of repair tools delivering sustainably sourced, best-in-class quality tools for use in production based repair and refurbishment

SmartGrade Pro™ implements on site factory audits with our partners in Europe and Asia to ensure our partners adhere to strict quality standards. We conduct regular on-site audits, setting an industry standard for our commitment to environmental and social sustainability through every step of our supply-chain.

Understanding that quality is dependent on constant innovation, our Closed-Loop Corrective Actions Process, implements corrective actions following investigation of client feedback.

Our partners share in our success, and actively pursue a customer experience unparalleled in the repair industry.

Lifetime No Hassle Warranty


The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available, we strive to provide a return policy that puts our clients first. RMAs are processed online to streamline your return process.
TLS-0229
Tool
Soldering tools
new
-
Honor 8X / 20i / 10 / 20 Youth
Reball stencils
-
Reball stencils
new

BGA Reball stencil for...

€4.06