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BGA Reball stencil for Hisilicon Kirin 960 HI3660 Huawei chipset

Product Overview:

SKU: TLS-0226
Device: Soldering tools
Part type: Tool
Condition: Original
Region: Huawei P10 / 10P
Mate 9 / 9 Pro
Nova 2S
Honor 9 / V9
Compatibility: Reball stencils

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Description

The BGA Reball stencil for Hisilicon Kirin 960 HI3660 Huawei chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.

Spécifications

Type de produit: Outil

SKU: TLS-0226

Dispositif: Soldering tools

Condition: Original

Région: Huawei P10 / 10P

Modèle no.: Reball stencils

Authenticité: Original

Garantie: Lifetime

Lifetime No Hassle Warranty

Lifetime No Hassle Warranty The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available

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