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BGA Reball stencil for Snapdragon 888 / SM8350 XiaoMi chipset

Product Overview:

SKU: TLS-0249
Device: Soldering tools
Part type: Tool
Condition: Original
Region: MI 11 / 11 ULTRA / 11 PRO / 11I / 11X PRO/ Redmi K40 Pro
Compatibility: Reball stencils

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Description

The BGA Reball stencil for Snapdragon 888 / SM8350 XiaoMi chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.

Spécifications

Type de produit: Outil

SKU: TLS-0249

Dispositif: Soldering tools

Condition: Original

Région: MI 11 / 11 ULTRA / 11 PRO / 11I / 11X PRO/ Redmi K40 Pro

Modèle no.: Reball stencils

Authenticité: Original

Garantie: Lifetime

Lifetime No Hassle Warranty

Lifetime No Hassle Warranty The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available

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