Stainless steel tweezers for mobile phone repair - Fine curved tip
SKU: TLS-0069, Device: Opening tools, Part type: Tool, Condition: Original, Region: Universal, Compatibility: Tweezers
BGA Reball stencil for Hisilicon Kirin 810 HI6280 Huawei chipset
Descripción
Description
The BGA Reball stencil for Hisilicon Kirin 810 HI6280 Huawei chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.
Especificaciones
Herramienta
TLS-0230
Soldering tools
Original
Honor 9X / 9X Pro / 20S / Nova 5 / 5I Pro / 5Z
Reball stencils
Original
Lifetime
Lifetime No Hassle Warranty
Lifetime No Hassle Warranty
The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available
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