SmartGrade Pro™ - BGA Reball stencil for MSM 8974/ 8274/ 8674 XiaoMi chipset

BGA Reball stencil for MSM 8974/ 8274/ 8674 XiaoMi chipset

Product Overview:

  • SKU: TLS-0237
  • Device: Soldering tools
  • Part type: Tool
  • Condition: Original
  • Region: MI 4 series MI3 / 3S / Note
  • Compatibility: Reball stencils

Descripción

Description


The BGA Reball stencil for MSM 8974/ 8274/ 8674 XiaoMi chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.

Especificaciones

Herramienta
TLS-0237
Soldering tools
Original
MI 4 series MI3 / 3S / Note
Reball stencils
Original
Lifetime

Lifetime No Hassle Warranty

Lifetime No Hassle Warranty The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available

BGA Reball stencil for MSM...

4,27 €