BGA Reball stencil for MSM 8974/ 8274/ 8674 XiaoMi chipset
Product Overview:
SKU: TLS-0237
Device: Soldering tools
Part type: Tool
Condition: Original
Region:
MI 4 series MI3 / 3S / Note
Compatibility: Reball stencils
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Descripción
Description
The BGA Reball stencil for MSM 8974/ 8274/ 8674 XiaoMi chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.
Especificaciones
Herramienta
TLS-0237
Soldering tools
Original
MI 4 series MI3 / 3S / Note
Reball stencils
Original
Lifetime
Lifetime No Hassle Warranty
Lifetime No Hassle Warranty
The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available