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BGA Reball stencil for Snapdragon / 865 / SM8250 XiaoMi chipset

Product Overview:

SKU: TLS-0247
Device: Soldering tools
Part type: Tool
Condition: Original
Region: Redmi K30 Pro / MI 10 / 10 Pro
Compatibility: Reball stencils

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Descripción

Description

The BGA Reball stencil for Snapdragon / 865 / SM8250 XiaoMi chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.

Especificaciones

Tipo de producto: Herramienta

SKU: TLS-0247

Dispositivo: Soldering tools

Condición: Original

Región: Redmi K30 Pro / MI 10 / 10 Pro

Nº de modelo: Reball stencils

Authenticity: Original

Garantía: Lifetime

Lifetime No Hassle Warranty

Lifetime No Hassle Warranty The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available

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