BGA Reball stencil for Hisilicon Kirin 710 HI6260 Huawei chipset
Product Overview:
SKU: TLS-0229
Device: Soldering tools
Part type: Tool
Condition: Original
Region: Honor 8X / 20i / 10 / 20 Youth
Enjoy10 / 10P / 9P / 9S
Nova 5I / 4E / 3I / 8
Compatibility: Reball stencils
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Description
Description
The BGA Reball stencil for Hisilicon Kirin 710 HI6260 Huawei chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.
Spécifications
Outil
TLS-0229
Soldering tools
Original
Honor 8X / 20i / 10 / 20 Youth
Reball stencils
Original
Lifetime
Lifetime No Hassle Warranty
Lifetime No Hassle Warranty
The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available
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