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BGA Reball stencil for Hisilicon Kirin 710 HI6260 Huawei chipset

Product Overview:

SKU: TLS-0229
Device: Soldering tools
Part type: Tool
Condition: Original
Region: Honor 8X / 20i / 10 / 20 Youth
Enjoy10 / 10P / 9P / 9S
Nova 5I / 4E / 3I / 8
Compatibility: Reball stencils

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Descrição

Description

The BGA Reball stencil for Hisilicon Kirin 710 HI6260 Huawei chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.

Especificações

Tipo de produto: Ferramenta

SKU: TLS-0229

Dispositivo: Soldering tools

Estado: Original

Região: Honor 8X / 20i / 10 / 20 Youth

Modelo: Reball stencils

Autenticidade: Original

Garantia: Lifetime

Lifetime No Hassle Warranty

Lifetime No Hassle Warranty The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available

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