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BGA Reball stencil for Snapdragon 665 / 710 / SM6125 / SDM710 XiaoMi chipset

Product Overview:

SKU: TLS-0246
Device: Soldering tools
Part type: Tool
Condition: Original
Region: MI CC9 / CC9E / 8SE / A3 Redmi Note 8 / 8 Pro
Compatibility: Reball stencils

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Description

The BGA Reball stencil for Snapdragon 665 / 710 / SM6125 / SDM710 XiaoMi chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.

Spécifications

Type de produit: Outil

SKU: TLS-0246

Dispositif: Soldering tools

Condition: Original

Région: MI CC9 / CC9E / 8SE / A3 Redmi Note 8 / 8 Pro

Modèle no.: Reball stencils

Authenticité: Original

Garantie: Lifetime

Lifetime No Hassle Warranty

Lifetime No Hassle Warranty The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available

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