BGA Reball stencil for Snapdragon / 865 / SM8250 XiaoMi chipset
SKU: TLS-0247, Device: Soldering tools, Part type: Tool, Condition: Original, Region:
Redmi K30 Pro / MI 10 / 10 Pro, Compatibility: Reball stencils
BGA Reball stencil for Snapdragon 636 / 660 XiaoMi chipset
Descrição
Description
The BGA Reball stencil for Snapdragon 636 / 660 XiaoMi chipset is available from SmartGrade Pro™ in original new condition. This tool is for use with the Reball stencils.
Especificações
Ferramenta
TLS-0241
Soldering tools
Original
Redmi Note 5 / Note 5 Pro / MI Note 3 / 6X
Reball stencils
Original
Lifetime
Lifetime No Hassle Warranty
Lifetime No Hassle Warranty
The product includes a Lifetime - No Hassle Warranty. While we take every precaution to ensure you receive the highest quality goods available
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